Simulation of Substrate Cooling during Evaporation of Pure Vapor from the Surface of a Thin Liquid Film and Droplets

Simulation of Substrate Cooling during Evaporation of Pure Vapor from the Surface of a Thin Liquid Film and Droplets Full article

Journal

Journal of Applied and Industrial Mathematics
ISSN: 1990-4789

Output data

Year: 2023, Volume: 17, Number: 3, Pages: 582–591 Pages count : DOI: 10.1134/S1990478923030110

Authors

Kupershtokh A.L. ¹ , Medvedev D.A. ¹ , Alyanov A.V. ¹

Affiliations

1	Lavrentyev Institute of Hydrodynamics, Siberian Branch, Russian Academy of Sciences

Funding (1)

Министерство науки и высшего образования Российской Федерации

FWGG-2021-0006

Kupershtokh A.L. , Medvedev D.A. , Alyanov A.V.
Simulation of Substrate Cooling during Evaporation of Pure Vapor from the Surface of a Thin Liquid Film and Droplets
Journal of Applied and Industrial Mathematics. 2023. V.17. N3. P.582–591. DOI: 10.1134/S1990478923030110 Scopus РИНЦ OpenAlex

Куперштох А.Л. , Медведев Д.А. , Альянов А.В.
МОДЕЛИРОВАНИЕ ОХЛАЖДЕНИЯ ПОДЛОЖКИ ПРИ ИСПАРЕНИИ ЧИСТОГО ПАРА С ПОВЕРХНОСТИ ТОНКОЙ ПЛЁНКИ И КАПЕЛЬ ЖИДКОСТИ
Сибирский журнал индустриальной математики. 2023. Т.26. №3. С.73-85. DOI: 10.33048/SIBJIM.2023.26.306 РИНЦ

Submitted:	Apr 17, 2023
Accepted:	Apr 27, 2023
Published print:	Sep 30, 2023

Scopus:	2-s2.0-85174321360
Elibrary:	63902667
OpenAlex:	W4388337264

DB	Citing
Scopus	1