Abstract: Pulsed electric current can be used for the fast sintering of powders as well as joining of macroobjects. In this work, we brazed copper plates using a silver layer that was formed in situ by the decomposition of a silver oxalate Ag2C2O4 powder placed between the plates. Joining was conducted in the chamber of a Spark Plasma Sintering (SPS) facility with and without a graphite die. In the die-assisted tooling configuration, indirect heating of the assembly from the graphite die carrying electric current occurred until the brazing layer transformed into metallic silver. The passage of electric current through a Cu/Ag2C2O4/Cu stack placed between the electrodes without a die was possible because of the formation of Cu/Cu contacts in the areas free from the Ag2C2O4 particles. Joints that were formed in the die-assisted experiments showed a slightly higher shear strength (45 MPa) in comparison with joints formed without a die (41 MPa). The shear strength of the reference sample (obtained without a die), a stack of copper plates joined without any brazing layer, was only 31 MPa, which indicates a key role of the silver in producing strong bonding between the plates. This study shows that both die-assisted tooling configurations and those without a die can be used for the SPS brazing of materials by the oxalate-derived silver interlayer.

Cite: Dudina D. , Matvienko A. , Sidelnikov A. , Legan M. , Mali V. , Esikov M. , Anisimov A. , Gribov P. , Boldyrev V.
Electric Current-Assisted Joining of Copper Plates Using Silver Formed by In-Situ Decomposition of Ag2C2O4
Metals. 2018. V.8. N7. P.538. DOI: 10.3390/met8070538 WOS Scopus РИНЦ OpenAlex

Identifiers:

Web of science:	WOS:000445096800068
Scopus:	2-s2.0-85050510268
Elibrary:	35770905
OpenAlex:	W2814071308

Citing:

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Scopus	3
OpenAlex	4
Elibrary	8
Web of science	2

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